B560 Mtx Mini PC I5/I7 Processor 8GB RAM 512GB SATA3.0 SSD, Windows 11 PRO Mini Computer/Dual-Channel DDR4/2*HDMI3.0
| US$128.00 - 160.00 | 50 Pieces (MOQ) |
Port:
Shenzhen, China
Production Capacity:
20000
Payment Terms:
L/C, T/T, Paypal
Guangdong, China
Last Login Date:
Apr 08, 2025
Business Type:
Manufacturer/Factory, Trading Company
Product Description
Company Info
Basic Info.
RAM Capacity
2GB
Storage Type
SSD
Chipset Group
B560, H510
CPU Type
Intel 11th Gen Socket CPU I3, I5, I7
Display Port
HDMI X 2 + Dp X 1
RAM
2 X SODIMM DDR4, Max 64GB
SSD
M.2 Nvme & Sataiii SSD
GPU Type
Intel UHD Graphics 730/750
LAN
RJ45, Gigabit LAN
WiFi
M.2 Pcie Port
Dimension
18 X 18 X 4cm
Type-C
USB3.2 Gen2 Type-C
USB3.2
USB3.2 Gen 2 X 2
USB3.1
USB3.1 X 2
USB2.0
USB2.0 X 2
Volume
1.2L
Tpm
Tpm Spi
Trademark
NEWSMAY/OEM
HS Code
8471494000
Product Description
Specification:
| Size | 182* 179 * 37mm |
| CPU | Intel 11th Gen, 10th Gen socket Core i3,i5,i7 or socket pentium CPU, the TDP 65W or 35W i3-10100 i5-10400/10500/11400/11500/11500T i7-10700/11700 |
| Chipset group | INTEL B560/H510 |
| Memory | 2* SO-DIMM DDR4 , max 64GB |
| Storage | m.2 2280 SATA/NVME SSD 2 x 2.5"HDD /SSD |
| Graphics | Intel® UHD Graphics 730/750 |
| Display Port | 2 x HDMI + 1 x DP |
| Front I/O | 1 x USB 3.2 GEN2 Type-C(10Gb/s) 1 x USB3.2 Gen1 1 x USB3.2 Gen1 1 x Power button Line in(MIC) *1, Line out(Audio)*1 |
| Rear I/O | 2 x HDMI2.0b 1 x DP1.4 1 x DC(19V4.74A or 19V6.15A) 1x RJ45(Gigabit LAN, Realtek 8111H) 2 x USB3.1 GEN1 2 x USB2.0 |
| Header on MB | 2 x USB2.0 1 x COM232 1 x TPM(ASROCK TPM SPI 14-1 pin module) |
| AMIBIOS | WAKE ON LAN AUTO POWER ON RTC PXE |
| Wireless | m.2 PCIe Wi-Fi module port |
| VESA Mount | Support |
| LAN | RJ45 (Gigabit LAN) |
| Power Supply | DC 19V4.74A(i3 CPU or 35W TDP CPU), 19V6.15A(i5 or i7 CPU,) |
About this item
- Intel 10th/11th Generation processor
- High capacity & Expansion Options
- 4K Screen Display and Wireless Supports
- Additional Function & Pro Customer Service
OEM & ODM Service >>>Contact us<<< | |
OEM | 1. logo printing on housing 2. Customize package 3. Software Customization: Booting image, UI, APP, Function… and so on |
ODM | 1. PCBA desgin 2. Housing desgin 3. Software Customization: Booting image, UI, APP, Function… and so on |
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